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Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.

S. Alam, C. Gan, C. Thompson, and D. Troxel. Microelectronics Journal, 38 (4-5): 463-473 (2007)

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M. Nudischer

M. Kratzer

M. Liewald

M. Fittingho

M. Christmann

Other publications of authors with the same name

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.N. Khan, S. Alam, and S. Hassoun. IEEE Trans. VLSI Syst., 19 (4): 647-658 (2011)Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology.S. Alam, R. Jones, S. Rauf, and R. Chatterjee. ISQED, page 580-585. IEEE Computer Society, (2007)Circuit Level Reliability Analysis of Cu Interconnects.S. Alam, C. Gan, C. Thompson, and D. Troxel. ISQED, page 238-243. IEEE Computer Society, (2004)STT-Based Non-Volatile Logic-in-Memory Framework.J. Das, S. Alam, and S. Bhanja. Field-Coupled Nanocomputing, volume 8280 of Lecture Notes in Computer Science, Springer, (2014)BIST to Detect and Characterize Transient and Parametric Failures.A. Sanyal, S. Alam, and S. Kundu. IEEE Design & Test of Computers, 27 (5): 50-59 (2010)Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits.I. Savidis, S. Alam, A. Jain, S. Pozder, R. Jones, and R. Chatterjee. Microelectronics Journal, 41 (1): 9-16 (2010)Welcome to ISQED 2013.M. Budnik, R. Topaloglu, P. Chatterjee, K. Bowman, K. Gadepally, P. Wesling, S. Alam, and R. Joshi. ISQED, IEEE, (2013)System-level comparison of power delivery design for 2D and 3D ICs.N. Khan, S. Alam, and S. Hassoun. 3DIC, page 1-7. IEEE, (2009)Study of Circuit-Specific Error Bounds for Fault-Tolerant Computation using Maximum a posteriori (MAP) HypothesisK. Lingasubramanian, S. Alam, and S. Bhanja. CoRR, (2009)Thermal aware cell-based full-chip electromigration reliability analysis.S. Alam, D. Troxel, and C. Thompson. ACM Great Lakes Symposium on VLSI, page 26-31. ACM, (2005)

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Disambiguation of "Alam, Syed M."

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Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.

Please choose a person to relate this publication to

M. Nudischer

M. Kratzer

M. Liewald

M. Fittingho

M. Christmann

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Alam, Syed M."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.

Please choose a person to relate this publication to

M. Nudischer

M. Kratzer

M. Liewald

M. Fittingho

M. Christmann

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.