%0 Conference Paper %1 conf/isqed/AlamLTT04 %A Alam, Syed M. %A Gan, Chee Lip %A Thompson, Carl V. %A Troxel, Donald E. %B ISQED %D 2004 %I IEEE Computer Society %K dblp %P 238-243 %T Circuit Level Reliability Analysis of Cu Interconnects. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2004.html#AlamLTT04 %@ 0-7695-2093-6

@inproceedings{conf/isqed/AlamLTT04, added-at = {2014-09-27T00:00:00.000+0200}, author = {Alam, Syed M. and Gan, Chee Lip and Thompson, Carl V. and Troxel, Donald E.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2febd79e5bd250be76480edff18ab9222/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2004}, ee = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2004.1283680}, interhash = {899e5c76683badfcb66e7b03d33f1bc8}, intrahash = {febd79e5bd250be76480edff18ab9222}, isbn = {0-7695-2093-6}, keywords = {dblp}, pages = {238-243}, publisher = {IEEE Computer Society}, timestamp = {2016-02-02T13:53:03.000+0100}, title = {Circuit Level Reliability Analysis of Cu Interconnects.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2004.html#AlamLTT04}, year = 2004 }