%0 Journal Article %1 journals/tvlsi/KhanAH11 %A Khan, Nauman H. %A Alam, Syed M. %A Hassoun, Soha %D 2011 %J IEEE Trans. VLSI Syst. %K dblp %N 4 %P 647-658 %T Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies. %U http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi19.html#KhanAH11 %V 19

@article{journals/tvlsi/KhanAH11, added-at = {2011-04-18T00:00:00.000+0200}, author = {Khan, Nauman H. and Alam, Syed M. and Hassoun, Soha}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2dcf402df9b2419b22a3f19d27f99ab3b/dblp}, ee = {http://dx.doi.org/10.1109/TVLSI.2009.2038165}, interhash = {e4937ff19e43f5f11425a0f0bf612483}, intrahash = {dcf402df9b2419b22a3f19d27f99ab3b}, journal = {IEEE Trans. VLSI Syst.}, keywords = {dblp}, number = 4, pages = {647-658}, timestamp = {2016-02-02T02:13:23.000+0100}, title = {Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies.}, url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi19.html#KhanAH11}, volume = 19, year = 2011 }