Author of the publication

Thermal aware cell-based full-chip electromigration reliability analysis.

, , and . ACM Great Lakes Symposium on VLSI, page 26-31. ACM, (2005)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Circuit Level Reliability Analysis of Cu Interconnects., , , and . ISQED, page 238-243. IEEE Computer Society, (2004)A dithering algorithm for local composition control with three-dimensional printing., , , and . Computer-Aided Design, 35 (9): 851-867 (2003)Page composition of continuous tone imagery., and . Computer Vision, Graphics, and Image Processing, 26 (1): 30-44 (1984)Page composition of continuous tone imagery., and . Computer Vision, Graphics, and Image Processing, 22 (1): 204 (1983)Automated Engraving of Gravure Cylinders., , , , , , and . IEEE Trans. Systems, Man, and Cybernetics, 11 (9): 585-596 (1981)Scaling Binary Images with the Telescoping Template., and . IEEE Trans. Pattern Anal. Mach. Intell., 4 (3): 331-335 (1982)An Interactive Image Processing System.. IEEE Trans. Pattern Anal. Mach. Intell., 3 (1): 95-101 (1981)Electromigration Reliability Comparison of Cu and Al Interconnects., , , , and . ISQED, page 303-308. IEEE Computer Society, (2005)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations., , , and . Microelectronics Journal, 38 (4-5): 463-473 (2007)A Comprehensive Layout Methodology and Layout-Specific Circuit Analyses for Three-Dimensional Integrated Circuits., , and . ISQED, page 246-251. IEEE Computer Society, (2002)