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Disambiguation of "Jones, Robert E."

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Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology.

, , , and . ISQED, page 580-585. IEEE Computer Society, (2007)

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E. Zafeiriou

E. Garrelts

Robert Walter University of Stuttgart

Front Cover: The Best of Both Worlds: Combining the Power of MICs and WCAs To Generate Stable and Crystalline CrI-Tetracarbonyl Complexes with π-Accepting Ligands (Chem. Eur. J. 50/2023), , , , , and . Chemistry - A European Journal, 29 (50): e202302316 (2023)

Dr. Robert Löw University of Stuttgart

Replication Data for: Highly efficient real-time spatially resolved sensing of ultraviolet light, , , , , , , and . Dataset, (2025)Related to: Yannick Schellander, Fabian Munkes, Alexander Trachtmann, Patrick Schalberger, Robert Löw, Harald Kübler, Tilman Pfau, Norbert Fruehauf, "Highly efficient real-time spatially resolved sensing of ultraviolet light," Proc. SPIE 13109, Metamaterials, Metadevices, and Metasystems 2024, 1310906 (2024). doi: 10.1117/12.3028038.
Replication Data for: Highly efficient real-time spatially resolved sensing of ultraviolet light, , , , , , , and . Dataset, (2025)Related to: Yannick Schellander, Fabian Munkes, Alexander Trachtmann, Patrick Schalberger, Robert Löw, Harald Kübler, Tilman Pfau, Norbert Fruehauf, "Highly efficient real-time spatially resolved sensing of ultraviolet light," Proc. SPIE 13109, Metamaterials, Metadevices, and Metasystems 2024, 1310906 (2024). doi: 10.1117/12.3028038.Replication Data for: Ultraviolet Photodetectors and their Readout Realization for Future Active-Matrix Sensing, , , , , , , and . Dataset, (2025)Related to: Y. Schellander, M. Schamber, F. Munkes, R. Loew, P. Schalberger, H. Kübler, T. Pfau, and N. Fruehauf, “Ultraviolet photodetectors and their readout realization for future active-matrix sensing”, Proceedings of the International Display Workshops,30 (2023), 151-154. doi: 10.36463/idw.2023.0151.

Umm-E Habiba University of Stuttgart

Requirements Engineering for Explainable AI. 2023 IEEE 31st International Requirements Engineering Conference (RE), page 376-380. IEEE, (2023)
 

Other publications of authors with the same name

Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints., , , and . IET Computers & Digital Techniques, 5 (3): 169-178 (2011)Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration., , , , , and . IEEE Trans. VLSI Syst., 18 (3): 450-460 (2010)Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology., , , and . ISQED, page 569-575. IEEE Computer Society, (2009)Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits., , , , , and . Microelectronics Journal, 41 (1): 9-16 (2010)Tutorial 3: Process Technology Development and New Design Opportunities in 3D Integration Technology.. ISQED, page 5. IEEE Computer Society, (2008)Thermal Conductivity of Dilute Indium-Mercury Superconducting Alloys., , and . IBM Journal of Research and Development, 6 (1): 112-115 (1962)Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology., , , and . ISQED, page 580-585. IEEE Computer Society, (2007)Reconfigurable FPGA for Network Performance Evaluation., and . PDPTA, page 1124-1130. CSREA Press, (1999)Thin-film inductive heads., , , , , , , and . IBM Journal of Research and Development, 40 (3): 283-300 (1996)A Thermodynamic Treatment of Dilute Superconducting Alloys.. IBM Journal of Research and Development, 4 (1): 23-27 (1960)