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Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates, , , and . IEEE transactions on reliability, 66 (4): 1229-1237 (2017)3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements, , , , , , , and . (May 2017)Challenges in the fabrication of microstructured polymer optics, , , , and . Proceedings of the World Congress on Micro and Nano Manufacturing (WCMNM 2018), page 33-36. (September 2018)Duroplastische Verkapselungsgehäuse für die Integration von elektrischen Ankontaktierungen und Steckern, , , , , and . Beiträge zum 27. Stuttgarter Kunststoffkolloquium, 27, page 115-122. Institut für Kunststofftechnik, Universität Stuttgart, (2021)Miniaturisierter optischer Drehwinkelsensor mit integrierter Interpolation, , , , , , and . MikroSystemTechnik Kongress 2021, page 716-718. VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, VDE Verlag GmbH, (November 2021)Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels Laserlöten, , , , , , and . MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective Metalization, , , , , , , and . (2018)Duroplaste – Hightech für die mikroelektronischen Packages von morgen, , and . (2017)3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements, , , , , , , and . (2017)Practical Aspects and Limitations of Hermeticity Testing of Microencapsulations Using Cumulative Helium Leak Detection for Miniaturized Implantable Medical Devices, , , , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3): 351-359 (March 2020)