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Duroplastische Verkapselungsgehäuse für die Integration von elektrischen Ankontaktierungen und Steckern, , , , , and . Beiträge zum 27. Stuttgarter Kunststoffkolloquium, 27, page 115-122. Institut für Kunststofftechnik, Universität Stuttgart, (2021)Miniaturisierter optischer Drehwinkelsensor mit integrierter Interpolation, , , , , , and . MikroSystemTechnik Kongress 2021, page 716-718. VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, VDE Verlag GmbH, (November 2021)Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels Laserlöten, , , , , , and . MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Challenges in the fabrication of microstructured polymer optics, , , , and . Proceedings of the World Congress on Micro and Nano Manufacturing (WCMNM 2018), page 33-36. (September 2018)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective Metalization, , , , , , , and . (2018)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency Module, , , , , , and . (June 2023)Temperature Dependence of the Steering Angles of a Silicon Photonic Optical Phased Array, , and . IEEE Photonics Journal, 12 (2): 6800813 (2020)Transfer Learning for Test Time Reduction of Parameter Extraction in MEMS Accelerometers, , , and . Journal of microelectromechanical systems, 30 (3): 401-410 (2021)Towards a Tailored Engineering Design Process for Individualized Micro-Mechatronic Systems with a Novel Case-Based Methodology, , and . Applied Sciences, 11 (17): 7909 (2021)Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates, , , and . IEEE transactions on reliability, 66 (4): 1229-1237 (2017)