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Printing of Functional Structures on Molded 3D Devices, , , , , , , and . 11th International Congress Molded Interconnect Devices – Scientific Proceedings, volume 1038 of Advanced Materials Research, page 37--42. Trans Tech Publications, (November 2014)Flexible packaging by film assisted molding for microintegration of MEMS based sensors, , , , , , , , and . (2015)3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements, , , , , , , and . (May 2017)Duroplaste – Hightech für die mikroelektronischen Packages von morgen, , and . (2017)Feasibility of manufacturing packaged electronic systems by thermoset injection molding, , , , , and . Smart Systems Integration, (2017)Flexible packaging by film assisted molding for micro assembly technologies based on PCB, , , , , , , , and . International Conference and Exhibition on Integration Issues of Miniaturized Smart Systems, (2015)3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements, , , , , , , and . (2017)Feasibility of manufacturing packaged electronic systems by thermoset injection molding, , , , , and . (March 2017)3D laser direct-writing based master fabrication for injection compression molding of diffractive-refractive elements, , , , , , and . (2016)Leiterplattenbasiertes Packaging zur Systemintegration mittels Film-Assisted Transfer Molding. Universität Stuttgart, Stuttgart, Dissertation, (2018)