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Comparative study of thermal cycling and thermal shocks tests on electronic components reliability., , and . Microelectronics Reliability, 44 (9-11): 1343-1347 (2004)Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding., , , , , , , , , and . 3DIC, page 1-8. IEEE, (2014)200°C direct bonding copper interconnects : Electrical results and reliability., , , , , and . 3DIC, page 1-4. IEEE, (2011)Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence., , , , , , , , , and . Microelectronics Reliability, 55 (8): 1205-1213 (2015)Chip to wafer copper direct bonding electrical characterization and thermal cycling., , , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability., , , , , , , , , and 7 other author(s). IRPS, page 4. IEEE, (2018)Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2., , , and . Microelectronics Reliability, 42 (9-11): 1663-1666 (2002)A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices., , , , , , , , and . NEMS, page 486-489. IEEE, (2013)An overset grid method for large eddy simulation of turbomachinery stages., , , , , and . J. Comput. Physics, (2014)ITAC: A complete 3D integration test platform., , , , , , , , , and 10 other author(s). 3DIC, page 1-4. IEEE, (2016)