Author of the publication

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

, , , , , , , , , and . Microelectronics Reliability, 55 (8): 1205-1213 (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Salaün, Mathieu
add a person with the name Salaün, Mathieu
 

Other publications of authors with the same name