%0 Conference Paper %1 conf/irps/ArnaudMJJLFEEBB18 %A Arnaud, Lucile %A Moreau, Stéphane %A Jouve, Amadine %A Jani, Imed %A Lattard, Didier %A Fournel, F. %A Euvrard, C. %A Exbrayat, Y. %A Balan, V. %A Bresson, Nicolas %A Lhostis, S. %A Jourdon, J. %A Deloffre, E. %A Guillaumet, S. %A Farcy, Alexis %A Gousseau, Simon %A Arnoux, M. %B IRPS %D 2018 %I IEEE %K dblp %P 4 %T Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. %U http://dblp.uni-trier.de/db/conf/irps/irps2018.html#ArnaudMJJLFEEBB18 %@ 978-1-5386-5479-8

@inproceedings{conf/irps/ArnaudMJJLFEEBB18, added-at = {2022-02-18T00:00:00.000+0100}, author = {Arnaud, Lucile and Moreau, Stéphane and Jouve, Amadine and Jani, Imed and Lattard, Didier and Fournel, F. and Euvrard, C. and Exbrayat, Y. and Balan, V. and Bresson, Nicolas and Lhostis, S. and Jourdon, J. and Deloffre, E. and Guillaumet, S. and Farcy, Alexis and Gousseau, Simon and Arnoux, M.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2bd0c916bba3f39d59c5e04248225f0b9/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2018}, ee = {https://doi.org/10.1109/IRPS.2018.8353591}, interhash = {756282888fda4130daf65880be671b50}, intrahash = {bd0c916bba3f39d59c5e04248225f0b9}, isbn = {978-1-5386-5479-8}, keywords = {dblp}, pages = 4, publisher = {IEEE}, timestamp = {2022-03-01T07:25:50.000+0100}, title = {Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2018.html#ArnaudMJJLFEEBB18}, year = 2018 }