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Smart Skin for Robotics -- an example of a Complex System-In-Foil

, , , , , , , , , , , and . International Exhibition and Conference for the Printed Electronics Industry (LOPEC), Munich, Germany, (2017)

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Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips, , , , , , , and . Solid-state electronics, (2015)Combining organic and printed electronics in hybrid system in foil (HySiF) based smart skin for robotic applications, , , , , , , , and . 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015, page 1-6. Piscataway, NJ, IEEE, (2015)Komplexe Systeme in Folien ? die Nächste Generation Intelligenter Und Flexibler Foliensubstrate, , , , , , , and . page 34. (February 2016)1548.Smart Skin for Robotics -- an example of a Complex System-In-Foil, , , , , , , , , and 2 other author(s). International Exhibition and Conference for the Printed Electronics Industry (LOPEC), Munich, Germany, (2017)Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards, , , , , , , and . 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015 : Enabling technologies for a better life and future, page 1-4. Piscataway, NJ, IEEE, (2015)Komplexe Systeme in Folien? : Die nächste Generation intelligenter und flexibler Foliensubstrate, , , , , , , and . Elektronische Baugruppen und Leiterplatten : EBL 2016 Multifunktionale Baugruppen - Leistungsdichte am Limit? : 8. DVD/GMM-Tagung vom 16. bis 17. Februar 2016 in Fellbach, volume 321 of DVS-Berichte, page 31-34. Düsseldorf, DVS-Verlag, (2016)Hybrid Systems in Foil (HySiF) Exploiting Ultra-Thin Flexible Chips, , , , , and . 2014 44th European Solid State Device Research Conference (ESSDERC), page 210-213. Piscataway, New Jersey, IEEE, (2014)Technical, Medical and Ethical Challenges in Networks of Smart Active Implants., , , , , , , , , and 2 other author(s). EMBC, page 1484-1487. IEEE, (2019)