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Temperature Variation Characterization and Thermal Management of Multicore Architectures.

, and . IEEE Micro, 29 (1): 116-126 (2009)

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Exploring the effects of on-chip thermal variation on high-performance multicore architectures., and . TACO, 8 (1): 2:1-2:22 (2011)Investigating the effects of fine-grain three-dimensional integration on microarchitecture design., , , , and . JETC, 4 (4): 17:1-17:30 (2008)Characterizing Power and Temperature Behavior of POWER6-Based System., , , , , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 1 (3): 228-241 (2011)An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring., , , , , and . DAC, page 642-647. ACM, (2012)Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges., , , , , , and . ACM Great Lakes Symposium on VLSI, page 347-352. ACM, (2016)Early Quality Assessment for Low Power Behavioral Synthesis., , and . J. Low Power Electronics, 1 (3): 273-285 (2005)Temperature Variation Characterization and Thermal Management of Multicore Architectures., and . IEEE Micro, 29 (1): 116-126 (2009)Energy-Aware Accounting and Billing in Large-Scale Computing Facilities., , , , , , , and . IEEE Micro, 31 (3): 60-71 (2011)Power-efficient, reliable microprocessor architectures: modeling and design methods., , , , , , , , , and 5 other author(s). ACM Great Lakes Symposium on VLSI, page 299-304. ACM, (2010)Thermomechanical stress-aware management for 3D IC designs., , , and . DATE, page 1255-1258. EDA Consortium San Jose, CA, USA / ACM DL, (2013)