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Disambiguation of "Zou, Qiaosha"

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Thermomechanical stress-aware management for 3D IC designs.

, , , and . DATE, page 1255-1258. EDA Consortium San Jose, CA, USA / ACM DL, (2013)

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Dr. phil. Yiquan Zou University of Stuttgart

 

Other publications of authors with the same name

Compact models and model standard for 2.5D and 3D integration., and . SLIP, page 7:1-7:7. IEEE, (2014)3DHLS: Incorporating high-level synthesis in physical planning of three-dimensional (3D) ICs., , , and . DATE, page 1185-1190. IEEE, (2012)Designing vertical bandwidth reconfigurable 3D NoCs for many core systems., , , , and . 3DIC, page 1-7. IEEE, (2014)TSV power supply array electromigration lifetime analysis in 3D ICS., , , and . ACM Great Lakes Symposium on VLSI, page 239-240. ACM, (2014)Heterogeneous architecture design with emerging 3D and non-volatile memory technologies., , , , , and . ASP-DAC, page 785-790. IEEE, (2015)3DLAT: TSV-based 3D ICs crosstalk minimization utilizing Less Adjacent Transition code., , , and . ASP-DAC, page 762-767. IEEE, (2014)System-level design space exploration for three-dimensional (3D) SoCs., , , and . CODES+ISSS, page 385-388. ACM, (2011)SAIL: A Deep-Learning-Based System for Automatic Gait Assessment From TUG Videos., , , , , , and . IEEE Trans. Hum. Mach. Syst., 52 (1): 110-122 (2022)Cost-driven 3D design optimization with metal layer reduction technique., , and . ISQED, page 294-299. IEEE, (2013)A cost benefit analysis: The impact of defect clustering on the necessity of pre-bond tests., , and . 3DIC, page 1-7. IEEE, (2014)