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Is TSV-based 3D integration suitable for inter-die memory repair?, , , , , and . DATE, page 1251-1254. EDA Consortium San Jose, CA, USA / ACM DL, (2013)A 3D stacked high performance scalable architecture for 3D Fourier Transform., , and . ICCD, page 498-499. IEEE Computer Society, (2012)Is the road towards "Zero-Energy" paved with NEMFET-based power management?, , and . ISCAS, page 2561-2564. IEEE, (2012)3D stacked wide-operand adders: A case study., , , and . ASAP, page 133-141. IEEE Computer Society, (2013)Towards "zero-energy" using NEMFET-based power management for 3D hybrid stacked ICs., , and . NANOARCH, page 203-209. IEEE Computer Society, (2011)Surface Characterization of New Azulene-Based CMEs for Sensing., , , , , , and . Symmetry, 13 (12): 2292 (2021)Can SG-FET Replace FET in Sleep Mode Circuits?, , , , and . NanoNet, volume 20 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 99-104. Springer, (2009)Variation tolerant on-chip degradation sensors for dynamic reliability management systems., , , and . Microelectronics Reliability, 52 (9-10): 1787-1791 (2012)A Dry Membrane Protection Technique to Allow Surface Acoustic Wave Biosensor Measurements of Biological Model Membrane Approaches., , , , , , , and . Sensors, 13 (9): 12392-12405 (2013)Energy effective 3D stacked hybrid NEMFET-CMOS caches., , , and . NANOARCH, page 151-156. IEEE Computer Society/ACM, (2014)