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Injection compression molding of nanostructures from direct structured PVD hard coatings

H. Ruehl, T. Guenther, and A. Zimmermann. Proceedings of the World Congress on Micro and Nano Manufacturing (WCMNM 2022), page 63-66. Blk 11 Upper Boon Keng Road,, #12-931, Singapore 380011, Research Publishing (S) Pte Ltd, (September 2022)

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Univ. -Prof. Dr. -Ing. André Zimmermann University of Stuttgart

André Jaquemod University of Stuttgart

Dr. -Ing. André Buchau University of Stuttgart

Univ. -Prof. Dr. rer. nat. André Thess University of Stuttgart

André Loescher University of Stuttgart

Other publications of authors with the same name

CMOS-Compatible Measures for Thermal Management of Phase-Sensitive Silicon Photonic SystemsP. Krochin-Yepez, U. Scholz, and A. Zimmermann. Photonics, 7 (1): 6 (2020)Feasibility Study of Soft Tooling Inserts for Injection Molding with Integrated Automated SlidesT. Vieten, D. Stahl, P. Schilling, F. Civelek, and A. Zimmermann. Micromachines, 12 (7): 730 (2021)Assembly of Components on Inkjet-Printed Silver Structures by SolderingD. Juric, S. Hämmerle, K. Gläser, W. Eberhardt, and A. Zimmermann. IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (1): 156-162 (2019)Fabrication of curved diffractive optical elements by means of laser direct writing, electroplating, and injection compression moldingM. Roeder, S. Thiele, D. Hera, C. Pruss, T. Guenther, W. Osten, and A. Zimmermann. Journal of Manufacturing Processes, (2019)Minimally Invasive Sensors for Transurethral Impedance SpectroscopyC. Veil, S. Petillon, J. Hotz, A. Knöller, A. Zimmermann, and O. Sawodny. IEEE sensors journal, 21 (20): 22858-22867 (2021)Miniaturisierter optischer Drehwinkelsensor mit integrierter InterpolationJ. Seybold, A. Buelau, K. Fritz, A. Zimmermann, A. Frank, C. Scherjon, and J. Burghartz. MikroSystemTechnik Kongress 2021, page 716-718. VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, VDE Verlag GmbH, (November 2021)Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels LaserlötenT. Meißner, E. Saller, T. Groezinger, T. Vieten, H. Mueller, W. Eberhardt, and A. Zimmermann. MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective MetalizationE. Ermantraut, A. Zimmermann, H. Mueller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. (2018)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency ModuleM. Wolf, W. Eberhardt, T. Guenther, A. Zimmermann, T. Scherzer, J. Utz, and H. Ruckdaeschel. (June 2023)Effect of high current pulses on solder interfacial reaction and interconnect reliabilityJ. Mei, R. Haug, T. Grözinger, and A. Zimmermann. Microelectronics reliability, 122 (July): 114151 (2021)