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Disambiguation of "Hofmann, Klaus"

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A Fast Congestion-Aware Flow Control Mechanism for ID-Based Networks-on-Chip with Best-Effort Communication.

, , , and . DSD, page 63-70. IEEE Computer Society, (2011)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Gloria Hofmann University of Stuttgart

Janos Klaus University of Stuttgart

Dr. Lisa Hofmann University of Stuttgart

Philipp Hofmann University of Stuttgart

Klaus Hentschel

 

Other publications of authors with the same name

Impact of group delay on tunable impedance matching networks based on Barium-Strontium-Titanate varactors., , , , , , , and . ISSSE, page 1-5. IEEE, (2012)A hardware/software co-design reconfigurable Network-on-Chip FPGA emulation method., , and . ReCoSoC, page 1-8. IEEE, (2014)An efficient maximum power point tracking algorithm for solar PV panels., , , and . NORCHIP, page 1-4. IEEE, (2014)Reconfigurable radio frontends for cooperative sensor networks: Tasks and challenges., , , , , , and . SPAWC, page 515-519. IEEE, (2013)Deadlock-free routing algorithms for 3-dimension Networks-on-Chip with reduced vertical channel density topologies., , and . HPCS, page 268-274. IEEE, (2012)GSNoC - The comprehensive design platform for 3-dimensional Networks-on-Chip based many core embedded systems., , and . HPCS, page 217-223. IEEE, (2013)Redundant Double Conversion based Digital Background Calibration of SAR ADC with Convergence Acceleration and Assistance., , , , and . MIXDES, page 192-197. IEEE, (2018)Online bicast allocation algorithm for contention-free-routing NoCs., , , , and . ICECS, page 324-327. IEEE, (2015)Hybrid tooling by a combination of high speed cutting and electrochemical milling with ultrashort voltage pulses, , and . Microsystem Technologies, 14 (2): 249--254 (2008)ECF - An innovative Technique for Micro Mould Fabrication, , and . First International Conference on Multi-Material Micro Manufacture Proceedings, page 375-377. Elsevier, (2005)