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A flexible stress sensor using a sub-10μm silicon chip technology

S. Ferwana, E. Angelopoulos, S. Endler, C. Harendt, and J. Burghartz. 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), page 2628-2631. Piscataway, New Jersey, IEEE, (2013)
DOI: 10.1109/Transducers.2013.6627345

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Stefan Kunert University of Stuttgart

Stefan Schippling University of Stuttgart

Stefan Hecht University of Stuttgart

Stefan Köbel University of Stuttgart

Stefan Esselborn University of Stuttgart

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Compensation of externally applied mechanical stress by stacking of ultra-thin chipsS. Endler, H. Rempp, C. Harendt, and J. Burghartz. 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 279-282. Piscataway, New Jersey, IEEE, (2011)Stacked Ultrathin Chips with TSVs enabling 3D Flex-SensorsS. Ferwana, S. Endler, C. Harendt, and J. Burghartz. (2012)Ultra-thin chip technology for system-in-foil applicationsE. Angelopoulos, M. Zimmermann, W. Appel, S. Endler, S. Ferwana, C. Harendt, H. Tu, A. Pruemm, and J. Burghartz. 2010 International Electron Devices Meeting, page 2.5.1.-2.5.4.. Piscataway, New Jersey, IEEE, (2010)Training- and Contest-scheduling in Endurance Sports by Means of Course Profiles and PerPot-based Analysis.J. Perl, and S. Endler. Int. J. Comp. Sci. Sport, (2006)Bending-Stress Management by Stacking of Ultrathin Integrated Circuit ChipsS. Endler. Universität Stuttgart, Dissertation, (October 2012)Compensation pf Externally Applied Mechanical Stress by Stacking Of Ultrathin ChipsS. Endler, H. Rempp, C. Harendt, and J. Burghartz. Solid-State Electronics, (August 2012)Mechanical Stability of Ultra-Thin Chips Down to 6 ΜmC. Harendt, E. Angelopoulos, S. Endler, M. Hassan, T. Hoang, and J. Burghartz. (2010)A flexible stress sensor using a sub-10μm silicon chip technologyS. Ferwana, E. Angelopoulos, S. Endler, C. Harendt, and J. Burghartz. 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII), page 2628-2631. Piscataway, New Jersey, IEEE, (2013)Packaging Challenges Associated With Warpage Of Ultra-Thin ChipsM. Hassan, E. Angelopoulos, H. Rempp, S. Endler, and J. Burghartz. 3rd Electronics System Integration Technology Conference ESTC, Piscataway, New Jersey, IEEE, (2010)Performance Estimation using the Fitness-Fatigue Model with Kalman Filter Feedback.D. Kolossa, M. Azhar, C. Rasche, S. Endler, F. Hanakam, A. Ferrauti, and M. Pfeiffer. Int. J. Comp. Sci. Sport, 16 (2): 117-129 (2017)