%0 Conference Paper %1 hassan2010packaging %A Hassan, Mahadi-Ul %A Angelopoulos, Evangelos %A Rempp, Horst %A Endler, Stefan %A Burghartz, Joachim N. %B 3rd Electronics System Integration Technology Conference ESTC %C Piscataway, New Jersey %D 2010 %I IEEE %K INES %R 10.1109/ESTC.2010.5642819 %T Packaging Challenges Associated With Warpage Of Ultra-Thin Chips %@ 978-1-4244-8553-6 and 978-1-4244-8555-0 and 978-1-4244-8554-3

@inproceedings{hassan2010packaging, added-at = {2019-03-13T17:23:03.000+0100}, address = {Piscataway, New Jersey}, author = {Hassan, Mahadi-Ul and Angelopoulos, Evangelos and Rempp, Horst and Endler, Stefan and Burghartz, Joachim N.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2671b83aab14d7c70e4b48686fc23d69a/kevin.konnerth}, booktitle = {3rd Electronics System Integration Technology Conference ESTC}, doi = {10.1109/ESTC.2010.5642819}, eventdate = {2010-09-13/2010-09-16}, eventtitle = {3rd Electronics System Integration Technology Conference ESTC}, interhash = {980de14644b8beb98b757ecf295b5d41}, intrahash = {671b83aab14d7c70e4b48686fc23d69a}, isbn = {{978-1-4244-8553-6} and {978-1-4244-8555-0} and {978-1-4244-8554-3}}, keywords = {INES}, publisher = {IEEE}, timestamp = {2019-03-13T16:23:03.000+0100}, title = {Packaging Challenges Associated With Warpage Of Ultra-Thin Chips}, venue = {Berlin, Germany}, year = 2010 }