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Keep it straight: teaching placement how to better handle designs with datapaths.

, , , , , , and . ISPD, page 79-86. ACM, (2012)

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Double Patterning Layout Decomposition for Simultaneous Conflict and Stitch Minimization., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 29 (2): 185-196 (2010)Impact of Mechanical Stress on the Full Chip Timing for Through-Silicon-Via-based 3-D ICs., , , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (6): 905-917 (2013)Skew Management of NBTI Impacted Gated Clock Trees., and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (6): 918-927 (2013)Machine learning and pattern matching in physical design., , , and . ASP-DAC, page 286-293. IEEE, (2015)Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC., , , , and . ICCAD, page 563-570. IEEE Computer Society, (2011)Chemical-mechanical polishing aware application-specific 3D NoC design., , , and . ICCAD, page 207-212. IEEE Computer Society, (2011)A high-performance triple patterning layout decomposer with balanced density., , , , , and . ICCAD, page 163-169. IEEE, (2013)Fast Incremental Link Insertion in Clock Networks for Skew Variability Reduction., and . ISQED, page 79-84. IEEE Computer Society, (2006)Cut Redistribution and Insertion for Advanced 1-D Layout Design via Network Flow Optimization., , , , , , , and . IEEE Trans. VLSI Syst., 26 (9): 1613-1626 (2018)Total power optimization combining placement, sizing and multi-Vt through slack distribution management., , and . ASP-DAC, page 352-357. IEEE, (2008)