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%0 Conference Paper
%1 conf/iccad/JungLSPL11
%A Jung, Moongon
%A Liu, Xi
%A Sitaraman, Suresh K.
%A Pan, David Z.
%A Lim, Sung Kyu
%B ICCAD
%D 2011
%E Phillips, Joel R.
%E Hu, Alan J.
%E Graeb, Helmut
%I IEEE Computer Society
%K dblp
%P 563-570
%T Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC.
%U http://dblp.uni-trier.de/db/conf/iccad/iccad2011.html#JungLSPL11
%@ 978-1-4577-1399-6
@inproceedings{conf/iccad/JungLSPL11,
added-at = {2015-05-01T00:00:00.000+0200},
author = {Jung, Moongon and Liu, Xi and Sitaraman, Suresh K. and Pan, David Z. and Lim, Sung Kyu},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/23b25de1e3ab184e48eb49b837a8a2723/dblp},
booktitle = {ICCAD},
crossref = {conf/iccad/2011},
editor = {Phillips, Joel R. and Hu, Alan J. and Graeb, Helmut},
ee = {http://dl.acm.org/citation.cfm?id=2132455},
interhash = {523a827cfb9d838dba2537eb770cc6b7},
intrahash = {3b25de1e3ab184e48eb49b837a8a2723},
isbn = {978-1-4577-1399-6},
keywords = {dblp},
pages = {563-570},
publisher = {IEEE Computer Society},
timestamp = {2016-02-02T13:49:16.000+0100},
title = {Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC.},
url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2011.html#JungLSPL11},
year = 2011
}
