Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.

F. Lu, R. Ma, Z. Dong, L. Wang, C. Zhang, C. Wang, Q. Chen, X. Wang, F. Zhang, C. Li, H. Tang, Y. Cheng, and A. Wang. IEEE Trans. on Circuits and Systems, 63-I (10): 1746-1757 (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Chensheng Xu University of Stuttgart

Yifan Xie University of Stuttgart

Boyu Xian University of Stuttgart

Xiang Xu University of Stuttgart

Haijia Xu University of Stuttgart

Other publications of authors with the same name

A smartphone SP10T T/R switch in 180-nm SOI CMOS with 8kV+ ESD protection by co-design.X. Wang, X. Wang, F. Lu, L. Wang, R. Ma, Z. Dong, L. Sun, A. Wang, C. Yue, D. Wang and 1 other author(s). CICC, page 1-4. IEEE, (2013)A Full-Chip ESD Protection Circuit Simulation and Fast Dynamic Checking Method Using SPICE and ESD Behavior Models.F. Zhang, C. Wang, F. Lu, Q. Chen, C. Li, X. Wang, D. Li, and A. Wang. IEEE Trans. on CAD of Integrated Circuits and Systems, 38 (3): 489-498 (2019)Intelligent plankton image classification with deep learning.H. Al-Barazanchi, A. Verma, and S. Wang. IJCVR, 8 (6): 561-571 (2018)A 2-GS/s 8-Bit ADC Featuring Virtual-Ground Sampling Interleaved Architecture in 28-nm CMOS.X. Wang, X. Jin, J. Du, Y. Li, Y. Du, C. Wong, Y. Kuan, C. Chan, and M. Chang. IEEE Trans. on Circuits and Systems, 65-II (11): 1534-1538 (2018)A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.F. Lu, R. Ma, Z. Dong, L. Wang, C. Zhang, C. Wang, Q. Chen, X. Wang, F. Zhang, C. Li and 3 other author(s). IEEE Trans. on Circuits and Systems, 63-I (10): 1746-1757 (2016)More-Than-Moore: 3D heterogeneous integration into CMOS technologies.A. Wang, Q. Chen, C. Li, F. Lu, C. Wang, F. Zhang, X. Wang, J. Ng, Y. Xie, R. Ma and 2 other author(s). NEMS, page 1-4. IEEE, (2017)

PUMA

Disambiguation of "Wang, X. Shawn"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.

Please choose a person to relate this publication to

Chensheng Xu University of Stuttgart

Yifan Xie University of Stuttgart

Boyu Xian University of Stuttgart

Xiang Xu University of Stuttgart

Haijia Xu University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Wang, X. Shawn"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.

Please choose a person to relate this publication to

Chensheng Xu University of Stuttgart

Yifan Xie University of Stuttgart

Boyu Xian University of Stuttgart

Xiang Xu University of Stuttgart

Haijia Xu University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS.