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3D direct vertical interconnect microprocessors test vehicle.

J. Mayega, O. Erdogan, P. Belemjian, K. Zhou, J. McDonald, and R. Kraft. ACM Great Lakes Symposium on VLSI, page 141-146. ACM, (2003)

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Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU.R. Clarke, P. Jacob, O. Erdogan, P. Belemijian, S. Raman, M. LeRoy, T. Neogi, R. Kraft, D. Borca-Tasciuc, and J. McDonald. IEEE Access, (2015)A High Speed Reconfigurable Gate Array for Gigahertz Applications.J. Guo, C. You, M. Chu, O. Erdogan, R. Kraft, and J. McDonald. ISVLSI, page 124-129. IEEE Computer Society, (2005)Gigahertz FPGA by SiGe BiCMOS Technology for Low Power, High Speed Computing with 3-D Memory.C. You, J. Guo, R. Kraft, M. Chu, R. Heikaus, O. Erdogan, P. Curran, B. Goda, K. Zhou, and J. McDonald. FPL, volume 2778 of Lecture Notes in Computer Science, page 11-20. Springer, (2003)3D direct vertical interconnect microprocessors test vehicle.J. Mayega, O. Erdogan, P. Belemjian, K. Zhou, J. McDonald, and R. Kraft. ACM Great Lakes Symposium on VLSI, page 141-146. ACM, (2003)Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.P. Jacob, A. Zia, O. Erdogan, P. Belemjian, P. Jin, J. Kim, M. Chu, R. Kraft, and J. McDonald. ICCD, page 202-207. IEEE, (2007)Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.J. McDonald, O. Erdogan, P. Jacob, P. Belemjian, A. Gutin, A. Zia, M. Chu, J. Kim, R. Clarke, N. DeSimone and 2 other author(s). 3DIC, page 1-7. IEEE, (2009)The gigahertz FPGA: design consideration and applications.J. Guo, C. You, M. Chu, R. Heikaus, K. Zhou, O. Erdogan, J. Diao, B. Goda, R. Kraft, and J. McDonald. FPGA, page 248. ACM, (2004)Predicting the Performance of a 3D Processor-Memory Chip Stack.P. Jacob, O. Erdogan, A. Zia, P. Belemjian, R. Kraft, and J. McDonald. IEEE Design & Test of Computers, 22 (6): 540-547 (2005)Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology.X. Liu, S. Raman, R. Clarke, M. LeRoy, O. Erdogan, M. Chu, A. Gutin, R. Kraft, and J. McDonald. IEEE Trans. on Circuits and Systems, 61-II (3): 178-182 (2014)

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3D direct vertical interconnect microprocessors test vehicle.

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copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 3D direct vertical interconnect microprocessors test vehicle.

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3D direct vertical interconnect microprocessors test vehicle.