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3D NoC using through silicon Via: An asynchronous implementation., , , and . VLSI-SoC, page 232-237. IEEE, (2011)Fast and accurate power annotated simulation: Application to a many-core architecture., , , and . PATMOS, page 191-198. IEEE, (2013)2D to 3D Test Pattern Retargeting Using IEEE P1687 Based 3D DFT Architectures., , , , , and . ISVLSI, page 386-391. IEEE Computer Society, (2014)Thermal Aspects and High-Level Explorations of 3D Stacked DRAMs., , , , , , and . ISVLSI, page 609-614. IEEE Computer Society, (2015)On-line Power Optimization of Data Flow Multi-Core Architecture Based on Vdd-Hopping for Local Dynamic Voltage and Frequency Scaling., , , and . J. Low Power Electronics, 7 (2): 265-273 (2011)Fine-grain DVFS and AVFS techniques for complex SoC design: An overview of architectural solutions through technology nodes., , , , , and . ISCAS, page 1550-1553. IEEE, (2015)8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links., , , , , , , , , and 4 other author(s). ISSCC, page 146-147. IEEE, (2016)An Asynchronous Power Aware and Adaptive NoC Based Circuit., , , , , , , , , and 1 other author(s). J. Solid-State Circuits, 44 (4): 1167-1177 (2009)ITAC: A complete 3D integration test platform., , , , , , , , , and 10 other author(s). 3DIC, page 1-4. IEEE, (2016)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes., , , , , , and . 3DIC, page 1-5. IEEE, (2016)