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Disambiguierung von "Wigger, Benedikt"

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Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing

, , , , , , , , , , , und . 13th International Congress Molded Interconnect Devices, Seite 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)

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Um zwischen Personen mit demselben Namen zu unterscheiden, wird der akademische Grad und der Titel einer wichtigen Publikation angezeigt. Zudem lassen sich über den Button neben dem Namen einige der Person bereits zugeordnete Publikationen anzeigen.

Benedikt Kaiser University of Stuttgart

Reduction of the Backlash Effect for a Five-Phase Spatially Distributed Transverse Flux Machine, , , und . 2022 IEEE 7th Southern Power Electronics Conference (SPEC), Seite 1--6. IEEE, (05.12.2022 - 08.12.2022)

Benedikt Strahm University of Stuttgart

Replication Data for: Investigations on the Fire Behavior of Functionally Graded Concrete Slabs with Mineral Hollow Spheres, , und . Dataset, (2024)Related to: under preparation.

Benedikt Kolb University of Stuttgart

Benedikt Maurer University of Stuttgart

Benedikt Wiedemann University of Stuttgart

 

Weitere Publikationen von Autoren mit dem selben Namen

Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns, , , , und . Robotics and Computer-Integrated Manufacturing, (2020)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , und 1 andere Autor(en). (September 2018)Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns, , , , und . Robotics and Computer-Integrated Manufacturing, (2020)Inhärente Oberflächenstrukturen als Identifikationsmerkmal zur markierungsfreien Einzelteilverfolgung. Universität Stuttgart, Stuttgart, Dissertation, (2020)3D-MID Evaluation and Validation for Space Applications, , , , , , und . IEEE 69th Electronic Components and Technology Conference, Seite 868-877. Piscataway, NJ, IEEE, (2019)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , und 2 andere Autor(en). 13th International Congress Molded Interconnect Devices, Seite 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing Systems, , , und . Applied Sciences, 10 (8): 2806 (2020)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , und 1 andere Autor(en). (September 2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , und 1 andere Autor(en). (September 2018)Using unique surface patterns of injection moulded plastic components as an image based Physical Unclonable Function for secure component identification, , , , und . Scientific Reports, (2018)