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Weitere Publikationen von Autoren mit dem selben Namen

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane, , , , , , und . Sensors, (2021)Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates, , , , , , , , , und . Journal of manufacturing and materials processing, 6 (5): 119 (2022)Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates, , , , , , , , , und . Journal of Manufacturing and Materials Processing, (2022)Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications, , , , , und . Micromachines, (2024)Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications, , , , und . Journal of Manufacturing and Materials Processing, 6 (1): 9 (2022)Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications, , , , , und . Journal of Manufacturing and Materials Processing, (2023)Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder, , , , , , und . IEEE transactions on components, packaging and manufacturing technology, 12 (7): 1232-1240 (2022)Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications, , , , und . Journal of Manufacturing and Materials Processing, 6 (1): 9 (2022)Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane, , , , , , und . Sensors, 21 (16): 5557 (2021)Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications, , , , , und . Journal of manufacturing and materials processing, 7 (4): 139 (2023)