%0 Journal Article %1 jmmp6050119 %A Werum, Kai %A Mueller, Ernst %A Keck, Juergen %A Jaeger, Jonas %A Horter, Tim %A Glaeser, Kerstin %A Buschkamp, Sascha %A Barth, Maximilian %A Eberhardt, Wolfgang %A Zimmermann, André %D 2022 %J Journal of Manufacturing and Materials Processing %K %N 5 %R 10.3390/jmmp6050119 %T Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates %U https://www.mdpi.com/2504-4494/6/5/119 %V 6 %X Nowadays, digital printing technologies such as inkjet and aerosol jet printing are gaining more importance since they have proven to be suitable for the assembly of complex microsystems. This also applies to medical technology applications like hearing aids where patient-specific solutions are required. However, assembly is more challenging than with conventional printed circuit boards in terms of material compatibility between substrate, interconnect material and printed ink. This paper describes how aerosol jet printing of nano metal inks and subsequent assembly processes are utilized to connect electrical components on 3D substrates fabricated by Digital Light Processing (DLP). Conventional assembly technologies such as soldering and conductive adhesive bonding were investigated and characterized. For this purpose, curing methods and substrate pretreatments for different inks were optimized. Furthermore, the usage of electroless plating on printed metal tracks for improved solderability was investigated. Finally, a 3D ear mold substrate was used to build up a technology demonstrator by means of conductive adhesives.

@article{jmmp6050119, abstract = {Nowadays, digital printing technologies such as inkjet and aerosol jet printing are gaining more importance since they have proven to be suitable for the assembly of complex microsystems. This also applies to medical technology applications like hearing aids where patient-specific solutions are required. However, assembly is more challenging than with conventional printed circuit boards in terms of material compatibility between substrate, interconnect material and printed ink. This paper describes how aerosol jet printing of nano metal inks and subsequent assembly processes are utilized to connect electrical components on 3D substrates fabricated by Digital Light Processing (DLP). Conventional assembly technologies such as soldering and conductive adhesive bonding were investigated and characterized. For this purpose, curing methods and substrate pretreatments for different inks were optimized. Furthermore, the usage of electroless plating on printed metal tracks for improved solderability was investigated. Finally, a 3D ear mold substrate was used to build up a technology demonstrator by means of conductive adhesives.}, added-at = {2023-06-20T14:50:07.000+0200}, article-number = {119}, author = {Werum, Kai and Mueller, Ernst and Keck, Juergen and Jaeger, Jonas and Horter, Tim and Glaeser, Kerstin and Buschkamp, Sascha and Barth, Maximilian and Eberhardt, Wolfgang and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2601e5ae3c8302e6264ae191198fe9d06/samethalvaci}, doi = {10.3390/jmmp6050119}, interhash = {66130e1e22f4aa0864cf838698ea62e1}, intrahash = {601e5ae3c8302e6264ae191198fe9d06}, issn = {2504-4494}, journal = {Journal of Manufacturing and Materials Processing}, keywords = {}, number = 5, timestamp = {2023-06-20T14:50:45.000+0200}, title = {Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates}, url = {https://www.mdpi.com/2504-4494/6/5/119}, volume = 6, year = 2022 }