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Low-power receive electronics for a miniature real-time 3D ultrasound probe., , , , , , , , , and 4 other author(s). IWASI, page 235-238. IEEE, (2015)Backside Illuminated “Ge-on-Si” NIR Camera, , , , , , , , and . IEEE sensors journal, 21 (17): 18696-18705 (2021)Monolithic Integration of Gesn on Si for IR Camera Demonstration, , , , , , , , and . ECS Meeting Abstracts, MA2022-02 (32): 1169 (October 2022)Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips, , , , , , , and . Solid-state electronics, (2015)Ultra-Thin Sensor Systems Integrating Silicon Chips With On-Foil Passive And Active Components, , , , , , , and . EUROSENSORS 2018 Graz, Austria : 9–12 September 2018, volume 2 of Proceedings, Basel, MDPI AG, (2018)Thermal characterization and modeling of ultra-thin silicon chips., , , , , and . ESSDERC, page 397-400. IEEE, (2014)A 2x2 Pixel Array Camera based on a Backside Illuminated Ge-on-Si Photodetector, , , , , , and . 2019 IEEE SENSORS, page 1-4. (October 2019)Ge-on-Si camera for NIR detection, , , , , , , , and . 2021 IEEE 17th International Conference on Group IV Photonics (GFP), Piscataway, IEEE, (2021)Hybrid Systems in Foil (HySiF) Exploiting Ultra-Thin Flexible Chips, , , , , and . 2014 44th European Solid State Device Research Conference (ESSDERC), page 210-213. Piscataway, New Jersey, IEEE, (2014)