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Status of TFTLCD Color and Metrology., , and . Color Imaging Conference, page 301-304. IS&T - The Society for Imaging Science and Technology, (2000)Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection., , , , , , , , , and 10 other author(s). IBM Journal of Research and Development, 49 (4-5): 725-754 (2005)Colorimetric Tolerances of Various Digital Image Displays., , and . Color Imaging Conference, page 295-300. IS&T - The Society for Imaging Science and Technology, (2000)Active line repair for thin-film-transistor liquid crystal displays., , , , , , and . IBM Journal of Research and Development, 42 (3): 445-458 (1998)Image Quality Issues for High Resolution TFTLCDs., , , , , and . Color Imaging Conference, page 100-105. IS&T - The Society for Imaging Science and Technology, (1998)Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology., , , , , , , , , and 5 other author(s). CICC, page 659-662. IEEE, (2005)3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections., , , , , , , , , and 3 other author(s). IBM Journal of Research and Development, 52 (6): 611-622 (2008)Fabrication and characterization of robust through-silicon vias for silicon-carrier applications., , , , , , and . IBM Journal of Research and Development, 52 (6): 571-581 (2008)3D chip stacking with C4 technology., , , , , , , , , and 4 other author(s). IBM Journal of Research and Development, 52 (6): 599-609 (2008)A 10.5-in.-diagonal SXGA active-matrix display., , , , , , , , , and 18 other author(s). IBM Journal of Research and Development, 42 (3): 427-444 (1998)