%0 Conference Paper %1 wang2003throughwafer %A Wang, Zheao %A Wang, Lianwei %A Schellevis, Hugo %A Wien, Wim A. H. %A Burghartz, Joachim N. %A Sarro, Pasqualina M. %B Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands %C Utrecht %D 2003 %I Technology Foundation %K INES pagesmissing %T Through-Wafer Electrical Vias for RF Silicon Technology %@ 90-73461-39-1

@inproceedings{wang2003throughwafer, added-at = {2019-03-26T17:17:49.000+0100}, address = {Utrecht}, author = {Wang, Zheao and Wang, Lianwei and Schellevis, Hugo and Wien, Wim A. H. and Burghartz, Joachim N. and Sarro, Pasqualina M.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/27dfbf6e68231521422ee80b267e1ed5e/kevin.konnerth}, booktitle = {Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands}, eventdate = {2003-11-25/2003-11-27}, eventtitle = {14th ProRISC Workshop and the 6th SAFE Workshop}, interhash = {de5e815f1c268c9c34b829d8a86b9054}, intrahash = {7dfbf6e68231521422ee80b267e1ed5e}, isbn = {90-73461-39-1}, keywords = {INES pagesmissing}, publisher = {Technology Foundation}, timestamp = {2019-04-03T15:36:55.000+0200}, title = {Through-Wafer Electrical Vias for RF Silicon Technology}, venue = {Veldhoven, The Netherlands}, year = 2003 }