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Through-Wafer Electrical Vias for RF Silicon Technology

, , , , , and . Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands, Utrecht, Technology Foundation, (2003)

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Through-Wafer Electrical Vias for RF Silicon Technology, , , , , and . Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands, Utrecht, Technology Foundation, (2003)Silicon Micromachining Of High Aspect Ratio, High-Density Through-Wafer Electrical Interconnects For 3-D Multichip Packaging, , , , , , and . IEEE Transactions on Advanced Packaging, (August 2006)