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Through-Wafer Electrical Vias for RF Silicon Technology

Z. Wang, L. Wang, H. Schellevis, W. Wien, J. Burghartz, and P. Sarro. Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands, Utrecht, Technology Foundation, (2003)

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A. Laukemann

H. Binz

H. Bungartz

Erik Wimmer University of Stuttgart

Dr. phil. Alexander Wimmer University of Stuttgart

Other publications of authors with the same name

PACD Process Development : October 2002W. Wien, S. Milosavljevic, H. Schellevis, T. Scholtes, J. Heemskerk, C. Ortiz, J. Slabbekoorn, A. Polyakov, M. Bartek, J. Burghartz and 1 other author(s). (2002)Metal Patterning on High Topography Surface For 3-D RF Devices FabricationN. Pham, E. Boellaard, W. Wien, L. van Den Brekel, J. Burghartz, and P. Sarro. Eurosensors XVII : September 21 - 24, 2003, Guimarães, Portugal : book of abstracts : the 17th European Conference on Solid State Transducers, (2003)Through-Wafer Electrical Vias for RF Silicon TechnologyZ. Wang, L. Wang, H. Schellevis, W. Wien, J. Burghartz, and P. Sarro. Proceedings 2003 : ProRISC, SAFE : November 25 - 27 2003, Veldhoven, the Netherlands, Utrecht, Technology Foundation, (2003)Metal patterning on high topography surface for 3D RF devices fabricationN. Pham, E. Boellaard, W. Wien, L. van Den Brekel, J. Burghartz, and P. Sarro. Sensors and Actuators A : Physical, 115 (2-3): 557-562 (September 2004)Silicon Micromachining Of High Aspect Ratio, High-Density Through-Wafer Electrical Interconnects For 3-D Multichip PackagingZ. Wang, L. Wang, N. Nguyen, W. Wien, H. Schellevis, P. Sarro, and J. Burghartz. IEEE Transactions on Advanced Packaging, (August 2006)