%0 Thesis %1 mei2021reliability %A Mei, Jie %C Stuttgart %D 2021 %K diss oa phf07 ubs_10007 ubs_20011 ubs_30108 unibibliografie %R 10.18419/opus-11741 %T Reliability of solder interconnects under high current loading conditions

@phdthesis{mei2021reliability, added-at = {2021-11-03T12:51:14.000+0100}, address = {Stuttgart}, author = {Mei, Jie}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2a81fb737620cdc9ce8aef8f57e45e14a/unibiblio-3}, doi = {10.18419/opus-11741}, eventdate = {2021-07-23}, interhash = {897132b33a13c6174adac017332943dd}, intrahash = {a81fb737620cdc9ce8aef8f57e45e14a}, keywords = {diss oa phf07 ubs_10007 ubs_20011 ubs_30108 unibibliografie}, language = {eng}, school = {Universität Stuttgart}, supervisor = {Zimmermann, André}, supervisorgnd = {114014409X}, timestamp = {2021-11-03T11:51:14.000+0100}, title = {Reliability of solder interconnects under high current loading conditions}, type = {Dissertation}, year = 2021 }