T. Groezinger, P. Wild, and H. Kueck. Molded interconnect devices : 11th international congress ; September 24th - 25th, 2014, Nuremberg/Fuerth, Germany, (2014)
K. Hofmann, H. Kueck, H. Ruoff, and L. Staemmler. Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture, page 103-106. Whittles Publishing, (October 2007)
K. Hofmann, L. Staemmler, and H. Kueck. Proceedings of the 4th International Conference on Multi-Material Micro Manufacture, page 225-228. Whittles Publishing, (September 2008)