Author of the publication

Au electronic contacts.

V. Murugan, Z. Jia, G. Syaranamual, C. Gan, Y. Huang, and Z. Chen. Microelectronics Reliability, (2016)

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Andreas Ganzenmüller University of Stuttgart

Dr. rer. nat. Hansjörg Lipp University of Stuttgart

Max Lippoldt University of Stuttgart

Ulrike Ganz University of Stuttgart

Felix Lippkau University of Stuttgart

Other publications of authors with the same name

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.A. Lim, C. Boothroyd, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectronics Reliability, (2016)Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.C. Chua, H. Ong, K. Sanchez, P. Perdu, and C. Gan. Microelectronics Reliability, (2016)Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.A. Lim, A. Chang, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectronics Reliability, 54 (11): 2555-2563 (2014)Circuit Level Reliability Analysis of Cu Interconnects.S. Alam, C. Gan, C. Thompson, and D. Troxel. ISQED, page 238-243. IEEE Computer Society, (2004)Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.V. Murugan, Z. Jia, G. Syaranamual, C. Gan, Y. Huang, and Z. Chen. Microelectronics Reliability, (2016)Characterisation of defects generated during constant current InGaN-on-silicon LED operation.R. Made, Y. Gao, G. Syaranamual, W. Sasangka, L. Zhang, X. Nguyen, Y. Tay, J. Herrin, C. Thompson, and C. Gan. Microelectronics Reliability, (2017)Copper micro and nano particles mixture for 3D interconnections application.Y. Dai, M. Ng, P. Anantha, C. Gan, and C. Tan. 3DIC, page TS8.9.1-TS8.9.5. IEEE, (2015)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.S. Alam, C. Gan, C. Thompson, and D. Troxel. Microelectronics Journal, 38 (4-5): 463-473 (2007)Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.W. Sasangka, Y. Gao, C. Gan, and C. Thompson. Microelectronics Reliability, (2018)Unsupervised learning for signal mapping in dynamic photon emission.S. Chef, S. Jacquir, K. Sanchez, P. Perdu, S. Binczak, and C. Gan. Microelectronics Reliability, 55 (9-10): 1564-1568 (2015)

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Disambiguation of "Gan, Chee Lip"

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Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.

Please choose a person to relate this publication to

Andreas Ganzenmüller University of Stuttgart

Dr. rer. nat. Hansjörg Lipp University of Stuttgart

Max Lippoldt University of Stuttgart

Ulrike Ganz University of Stuttgart

Felix Lippkau University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Gan, Chee Lip"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.

Please choose a person to relate this publication to

Andreas Ganzenmüller University of Stuttgart

Dr. rer. nat. Hansjörg Lipp University of Stuttgart

Max Lippoldt University of Stuttgart

Ulrike Ganz University of Stuttgart

Felix Lippkau University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.