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Test-Cost Modeling and Optimal Test-Flow Selection of 3-D-Stacked ICs.

, and . IEEE Trans. on CAD of Integrated Circuits and Systems, 34 (9): 1523-1536 (2015)

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A graph-theoretic approach for minimizing the number of wrapper cells for pre-bond testing of 3D-stacked ICs., and . ITC, page 1-10. IEEE Computer Society, (2013)Test and Design-for-Testability Solutions for 3D Integrated Circuits., , , , , and . IPSJ Trans. System LSI Design Methodology, (2014)On the Effectiveness of DNS-based Server Selection., , and . INFOCOM, page 1801-1810. IEEE Comptuer Society, (2001)The hype, myths, and realities of testing 3D integrated circuits., , , and . ICCAD, page 58. ACM, (2016)A Distributed, Reconfigurable, and Reusable BIST Infrastructure for Test and Diagnosis of 3-D-Stacked ICs., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 35 (2): 309-322 (2016)Test-Cost Modeling and Optimal Test-Flow Selection of 3-D-Stacked ICs., and . IEEE Trans. on CAD of Integrated Circuits and Systems, 34 (9): 1523-1536 (2015)A dynamic programming solution for optimizing test delivery in multicore SOCs., , and . ITC, page 1-10. IEEE Computer Society, (2012)RouterFarm: towards a dynamic, manageable network edge., , , , , , , and . INM@SIGCOMM, page 5-10. ACM, (2006)Power Level Distributions of Radio Base Station Equipment and User Devices in a 3G Mobile Communication Network in India and the Impact on Assessments of Realistic RF EMF Exposure., , , , , and . IEEE Access, (2015)Development Tools for Distributed Applications., and . HotOS, page 49-54. USENIX, (2003)