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Minimal-Power, Delay-Balanced Smart Repeaters for Global Interconnects in the Nanometer Regime.

, , , and . IEEE Trans. VLSI Syst., 16 (5): 589-593 (2008)

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On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits., , , and . DATE, page 1325-1328. IEEE, (2010)3-D memory organization and performance analysis for multi-processor network-on-chip architecture., , , and . 3DIC, page 1-7. IEEE, (2009)Switching Sensitive Driver Circuit to Combat Dynamic Delay in On-Chip Buses., , , and . PATMOS, volume 3728 of Lecture Notes in Computer Science, page 277-285. Springer, (2005)Excitable London: Street map analysis with Oregonator model., , , , and . CoRR, (2018)Scalability of network-on-chip communication architecture for 3-D meshes., , , , , , and . NOCS, page 114-123. IEEE Computer Society, (2009)Minimal-power, delay-balanced smart repeaters for interconnects in the nanometer regime., , , and . SLIP, page 113-120. ACM, (2006)Extending systems-on-chip to the third dimension: performance, cost and technological tradeoffs., , , and . ICCAD, page 212-219. IEEE Computer Society, (2007)Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits., , , , and . 3DIC, page 1-8. IEEE, (2009)Modeling the computational efficiency of 2-D and 3-D silicon processors for early-chip planning., , , and . ICCAD, page 310-317. IEEE Computer Society, (2011)Minimal-Power, Delay-Balanced Smart Repeaters for Global Interconnects in the Nanometer Regime., , , and . IEEE Trans. VLSI Syst., 16 (5): 589-593 (2008)