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Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.

H. Tang, H. Ye, X. Chen, C. Qian, X. Fan, and G. Zhang. IEEE Access, (2017)

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Ye Feng University of Stuttgart

Weizhou Ye University of Stuttgart

Other publications of authors with the same name

A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes.H. Ye, R. Sokolovskij, H. van Zeijl, A. Gielen, and G. Zhang. Microelectronics Reliability, 54 (6-7): 1355-1362 (2014)Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system.H. Ye, J. Wei, H. van Zeijl, P. Sarro, and G. Zhang. Microelectronics Reliability, 54 (6-7): 1338-1343 (2014)Sorption and Diffusion of Water Vapor and Carbon Dioxide in Sulfonated Polyaniline as Chemical Sensing Materials.Q. Liang, J. Jiang, H. Ye, N. Yang, M. Cai, J. Xiao, and X. Chen. Sensors, 16 (5): 606 (2016)A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.B. Sun, X. Fan, H. Ye, J. Fan, C. Qian, W. van Driel, and G. Zhang. Rel. Eng. & Sys. Safety, (2017)Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes.H. Ye, B. Li, H. Tang, J. Zhao, C. Yuan, and G. Zhang. Microelectronics Reliability, 54 (11): 2448-2455 (2014)Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.H. Tang, H. Ye, X. Chen, C. Qian, X. Fan, and G. Zhang. IEEE Access, (2017)Thermal Management on IGBT Power Electronic Devices and Modules.C. Qian, A. Gheitaghy, J. Fan, H. Tang, B. Sun, H. Ye, and G. Zhang. IEEE Access, (2018)Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.H. Tang, H. Ye, C. Wong, S. Leung, J. Fan, X. Chen, X. Fan, and G. Zhang. Microelectronics Reliability, (2017)

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Disambiguation of "Ye, Huaiyu"

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Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.

Please choose a person to relate this publication to

Ye Feng University of Stuttgart

Weizhou Ye University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Ye, Huaiyu"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.

Please choose a person to relate this publication to

Ye Feng University of Stuttgart

Weizhou Ye University of Stuttgart

Other publications of authors with the same name

Disambiguation

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URL
DOI
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Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.