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Disambiguation of "Fan, Xuejun"

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Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.

, , , , , and . IEEE Access, (2017)

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Dr. Sisi Fan University of Stuttgart

Nicola Fanton University of Stuttgart

 

Other publications of authors with the same name

Modeling nonlinear moisture diffusion in inhomogeneous media., , , , and . Microelectronics Reliability, (2017)Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages., , , , and . Microelectronics Reliability, (2017)Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method., , , , , and . IEEE Access, (2019)Constructing Hyperelliptic Covers for Elliptic Curves over Quadratic Extension Fields., , , and . ACISP, volume 11547 of Lecture Notes in Computer Science, page 630-638. Springer, (2019)Speeding up Scalar Multiplication on Koblitz Curves Using _4 Coordinates., , , and . ACISP, volume 11547 of Lecture Notes in Computer Science, page 620-629. Springer, (2019)A Reliability Prediction Methodology for LED Arrays., , , , and . IEEE Access, (2019)Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling., , and . Microelectronics Reliability, 44 (12): 1967-1976 (2004)A new hermetic sealing method for ceramic package using nanosilver sintering technology., , , , , , and . Microelectronics Reliability, (2018)PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers., , , and . IEEE Trans. Industrial Electronics, 63 (11): 6726-6735 (2016)A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation., , , , , , and . Rel. Eng. & Sys. Safety, (2017)