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Disambiguation of "Pham, Nga Phuong"

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Substrate options and add-on process modules for monolithic RF silicon technology

, , , , , , , and . Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, page 17-23. Piscataway, New Jersey, IEEE, (2002)
DOI: 10.1109/BIPOL.2002.1042878

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Other publications of authors with the same name

Spray Coating of Photoresist for Pattern Transfer on High Topography Surfaces, , and . Journal of Micromechanics and Microengineering, 15 (4): 691-697 (2005)Metal Patterning on High Topography Surface For 3-D RF Devices Fabrication, , , , , and . Eurosensors XVII : September 21 - 24, 2003, Guimarães, Portugal : book of abstracts : the 17th European Conference on Solid State Transducers, (2003)Direct Spray Coating of Photoresist for MEMS Applications, , , , , and . Proc. SPIE 4557 : Micromachining and Microfabrication Process Technology VII, 4557, page 312-319. Bellingham, Washington, SPIE, (2001)RF-Devices Realised in MEMS by Using Electrodepositable Photoresist, , , and . Book of abstracts : SAFE2001 Semiconductor Advances for Future Electronics, ProRISC2001 Program for Research on Integrated Systems and Circuits, SeSens2001 Semiconductor Sensor and Actuator Technology, Utrecht, STW, Technology Foundation, (2001)Direct Spray Coating Of Photoresist : A New Method For Patterning 3-D Structures, , , , , and . Book of abstracts : Eurosensors XVI, The 16th European Conference on Solid-State Transducers, September 15 - 18, 2002, Prague, Czech Republic, page 89-90. Prag, Czech Technical University, (2002)Integrated Transmission Lines on High-Resistivity Silicon : Coplanar Waveguides or Microstrips?, , , , , and . 30th European Solid-State Device Research Conference, page 460-463. Piscataway, New Jersey, IEEE, (2000)Photoresist coating methods for the integration of novel 3-D RF microstructures, , , and . Journal of Microelectromechanical Systems, 13 (3): 491-499 (June 2004)IC-Compatible Two-Level Bulk Micromachining Process Module for RF Silicon Technology, , , and . IEEE Transactions on Electron Devices, 48 (8): 1756-1764 (August 2001)IC-Compatible Process For Pattern Transfer in Deep Wells For Integration Of RF Components, , and . Proc. SPIE 4174 : Micromachining and Microfabrication Process Technology VI, 4174, page 390-397. Bellingham, Washington, SPIE, (2000)Characterization of a bulk-micromachined post-process module: for silicon RF technology, , , , and . 2000 Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems : Digest of Papers, page 99-102. Piscataway, New Jersey, IEEE, (2000)