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Effects of salt spray test on lead-free solder alloy., , , , and . Microelectronics Reliability, (2016)Sequential combined thermal cycling and vibration test and simulation of printed circuit board., , , and . Microelectronics Reliability, (2018)A methodological approach for predictive reliability: Practical case studies., , , and . Microelectronics Reliability, 52 (12): 3035-3042 (2012)Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage., , , , and . Microelectronics Reliability, 49 (9-11): 1267-1272 (2009)How to study delamination in plastic encapsulated devices., , , and . Microelectronics Reliability, 44 (9-11): 1311-1316 (2004)Editorial., , , , and . Microelectronics Reliability, 55 (9-10): 1269-1270 (2015)Electro- and thermo-migration induced failure mechanisms in Package on Package., , and . Microelectronics Reliability, 52 (12): 2889-2906 (2012)A methodologic project to characterize and model COTS component reliability., , , , , and . Microelectronics Reliability, 55 (9-10): 2097-2102 (2015)Qualification procedure for moisture in embedded capacitors., , , , , and . Microelectronics Reliability, 54 (9-10): 2013-2016 (2014)Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers., , and . Microelectronics Reliability, 52 (9-10): 1827-1832 (2012)