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Reliability of 100 nm AlGaN/GaN HEMTs for mm-wave applications., , , , , , , , and . Microelectronics Reliability, (2017)Advanced FIB sample preparation techniques for high resolution TEM investigations of HEMT structures., , , and . Microelectronics Reliability, 54 (9-10): 1785-1789 (2014)Degradation of 0.25 μm GaN HEMTs under high temperature stress test., , , , , , , , , and 4 other author(s). Microelectronics Reliability, 55 (9-10): 1667-1671 (2015)High resolution physical analysis of ohmic contact formation at GaN-HEMT devices., , , , , , , , , and . Microelectronics Reliability, (2017)Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials., , , and . Microelectronics Reliability, 54 (9-10): 2000-2005 (2014)Physical failure analysis methods for wide band gap semiconductor devices., , , and . IRPS, page 3. IEEE, (2018)Comparison of reliability of 100 nm AlGaN/GaN HEMTs with T-gate and SAG-gate technology., , , , , , , and . Microelectronics Reliability, (2018)Correlation of gate leakage and local strain distribution in GaN/AlGaN HEMT structures., , , , , , and . Microelectronics Reliability, (2016)Cathodoluminescence spectroscopy for failure analysis and process development of GaN-based microelectronic devices., , , , , , and . IRPS, page 6. IEEE, (2018)