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Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.

X. Liu, Q. Chen, V. Sundaram, R. Tummala, and S. Sitaraman. Microelectronics Reliability, 53 (1): 70-78 (2013)

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K. Stahl

K. Gaiser

K. Lindow

Grzegorz K. Karch

Dipl.-Ing. Thomas Kuestner

Scan time reduction in DWI of the pancreas using simultaneous multislice technique with different acceleration factors: how fast can we go?J. Taron, P. Martirosian, T. Küstner, M. Notohamiprodjo, J. Weiß, A. Othman, K. Nikolaou, and C. Schraml. Proceedings of the International Society for Magnetic Resonance in Medicine (ISMRM), Honolulu, Hawaii, USA, (April 2017)The use of a generalized reconstruction by inversion of coupled systems (GRICS) approach for generic respiratory motion correction in PET/MR imagingH. Fayad, F. Odille, H. Schmidt, C. Würslin, T. Küstner, J. Felblinger, and D. Visvikis. Physics in medicine and biology, 60 (6): 2529-46 (March 2015)In-vivo MR-derived non-rigid motion correction of simultaneously acquired PETT. Küstner, C. Würslin, S. Gatidis, P. Martirosian, N. Schwenzer, B. Yang, and H. Schmidt. Proceedings of the International Society for Magnetic Resonance in Medicine (ISMRM), Toronto, Canada, (June 2015)

Other publications of authors with the same name

Compliance analysis of multi-path fan-shaped interconnects.W. Chen, R. Okereke, and S. Sitaraman. Microelectronics Reliability, 53 (7): 964-974 (2013)Multigated Carbon Nanotube Field Effect Transistors-Based Physically Unclonable Functions As Security Keys.N. Kumar, J. Chen, M. Kar, S. Sitaraman, S. Mukhopadhyay, and S. Kumar. IEEE Internet of Things Journal, 6 (1): 325-334 (2019)Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.X. Liu, Q. Chen, V. Sundaram, R. Tummala, and S. Sitaraman. Microelectronics Reliability, 53 (1): 70-78 (2013)Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages.A. Perkins, and S. Sitaraman. Microelectronics Reliability, 47 (12): 2260-2274 (2007)ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems.S. Zeng, R. Peak, A. Xiao, and S. Sitaraman. Eng. Comput. (Lond.), 24 (4): 359-381 (2008)ROM: a reliability knowledge representation for collaborative system design.I. Kim, R. Peak, and S. Sitaraman. Eng. Comput. (Lond.), 26 (1): 11-33 (2010)Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC.M. Jung, X. Liu, S. Sitaraman, D. Pan, and S. Lim. ICCAD, page 563-570. IEEE Computer Society, (2011)Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies.Y. Tian, X. Liu, J. Chow, Y. Wu, and S. Sitaraman. Microelectronics Reliability, 54 (5): 939-944 (2014)Laser moiré interferometry for fatigue life prediction of lead-free solders.K. Tunga, and S. Sitaraman. Microelectronics Reliability, 50 (12): 2026-2036 (2010)A Monobit Built-In Test and Diagnostic System for Flexible Electronic Interconnect.J. Lei, T. Moon, J. Chow, S. Sitaraman, and A. Chatterjee. ATS, page 191-196. IEEE, (2018)

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Disambiguation of "Sitaraman, Suresh K."

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Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.

Please choose a person to relate this publication to

K. Stahl

K. Gaiser

K. Lindow

Grzegorz K. Karch

Dipl.-Ing. Thomas Kuestner

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Sitaraman, Suresh K."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.

Please choose a person to relate this publication to

K. Stahl

K. Gaiser

K. Lindow

Grzegorz K. Karch

Dipl.-Ing. Thomas Kuestner

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.