%0 Journal Article %1 journals/mr/LiuCSTS13 %A Liu, Xi %A Chen, Qiao %A Sundaram, Venkatesh %A Tummala, Rao R. %A Sitaraman, Suresh K. %D 2013 %J Microelectronics Reliability %K dblp %N 1 %P 70-78 %T Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#LiuCSTS13 %V 53

@article{journals/mr/LiuCSTS13, added-at = {2013-02-06T00:00:00.000+0100}, author = {Liu, Xi and Chen, Qiao and Sundaram, Venkatesh and Tummala, Rao R. and Sitaraman, Suresh K.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/246f7cffe14b6e4de99b5542f989321b2/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2012.06.140}, interhash = {a0b06711f34c797c4632c32c186fde36}, intrahash = {46f7cffe14b6e4de99b5542f989321b2}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {70-78}, timestamp = {2016-02-02T02:02:10.000+0100}, title = {Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#LiuCSTS13}, volume = 53, year = 2013 }