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Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.

V. Afonso, A. Susin, L. Audibert, M. Saldanha, R. Conceicao, M. Porto, B. Zatt, and L. Agostini. ISCAS, page 1-4. IEEE, (2017)

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Dr. Vladimir Knjasev University of Stuttgart

Dr. Vladimir Atanasov University of Stuttgart

Vladimir Mikheev University of Stuttgart

Vladimir Yussupov University of Stuttgart

Other publications of authors with the same name

A multi-standard interpolation filter for motion compensated prediction on high definition videos.H. Maich, G. Paim, V. Afonso, L. Agostini, B. Zatt, and M. Porto. LASCAS, page 1-4. IEEE, (2015)Energy-Aware Motion and Disparity Estimation System for 3D-HEVC With Run-Time Adaptive Memory Hierarchy.V. Afonso, R. Conceicao, M. Saldanha, L. Braatz, M. Perleberg, G. Corrêa, M. Porto, L. Agostini, B. Zatt, and A. Susin. IEEE Trans. Circuits Syst. Video Techn., 29 (6): 1878-1892 (2019)HEVC Fractional Motion Estimation complexity reduction for real-time applications.H. Maich, V. Afonso, B. Zatt, L. Agostini, and M. Porto. LASCAS, page 1-4. IEEE, (2014)Low-Power and High-Throughput Architecture for 3D-HEVC Depth Modeling Mode 4.M. Ucker, V. Afonso, L. Audibert, A. Susin, B. Zatt, M. Porto, and L. Agostini. SBCCI, page 1-6. IEEE, (2018)An efficient sub-sample interpolator hardware for VP9-10 standards.G. Paim, W. Penny, J. Goebel, V. Afonso, A. Susin, M. Porto, B. Zatt, and L. Agostini. ICIP, page 2167-2171. IEEE, (2016)Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.V. Afonso, A. Susin, L. Audibert, M. Saldanha, R. Conceicao, M. Porto, B. Zatt, and L. Agostini. ISCAS, page 1-4. IEEE, (2017)High throughput hardware design for the HEVC Fractional Motion Estimation Interpolation Unit.H. Maich, V. Afonso, D. Franco, B. Zatt, M. Porto, and L. Agostini. ICECS, page 161-164. IEEE, (2013)A multi-standard interpolation hardware solution for H.264 and HEVC.H. Maich, G. Paim, V. Afonso, L. Agostini, B. Zatt, and M. Porto. ICIP, page 2910-2914. IEEE, (2015)A Power-Efficient and High-Throughput Hardware Design for 3D-HEVC Disparity Estimation.M. Perleberg, V. Afonso, R. Conceicao, A. Susin, L. Agostini, B. Zatt, and M. Porto. SBCCI, page 1-6. IEEE, (2018)Memory-Aware and High-Throughput Hardware Design for the HEVC Fractional Motion Estimation.V. Afonso, H. Maich, L. Audibert, B. Zatt, M. Porto, and L. Agostini. SBCCI, page 11:1-11:6. ACM, (2015)

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Disambiguation of "Afonso, Vladimir"

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Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.

Please choose a person to relate this publication to

Dr. Vladimir Knjasev University of Stuttgart

Dr. Vladimir Atanasov University of Stuttgart

Vladimir Mikheev University of Stuttgart

Vladimir Yussupov University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Afonso, Vladimir"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.

Please choose a person to relate this publication to

Dr. Vladimir Knjasev University of Stuttgart

Dr. Vladimir Atanasov University of Stuttgart

Vladimir Mikheev University of Stuttgart

Vladimir Yussupov University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.