Author of the publication

Design Methodology for Ultra-Compact Rogowski-Coils for Current Sensing in Low-Voltage High-Current GaN Based DC/DC-Converters

, , , and . 23rd European Conference on Power Electronics and Applications (EPE), (2021)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Efficiency Requirements for Passively Cooled Converters with Thermal Measurement Based 3D-FEM Simulation, , , , and . 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), (2020)Thermal Impedance Calibration for Rapid and Non-Invasiv Calorimetric Soft-Switching Loss Characterization, , , and . IEEE Trans. on Power Electronics, (2023)Asymmetric Packages for Optimal Performance of GaN-HEMT using PCB Fabrication Technology, , , , and . in Proc. PCIM Europe Conference, (2021)Latent Heat Storage for Fast-Charging, High Power Density Battery Chargers, , , and . IEEE Trans. on Emerging and Selected Topics in Power Electronics, (2023)Multi Domain Optimization of Power Electronic Devices, and . Seminar Electro thermal analysis for power electronics, Keysight Technologies, (2016)Temperature control system using a hybrid discontinuous modulation technique to improve the lifetime of IGBT power modules, , , , and . 2016 18th European Conference on Power Electronics and Applications (EPE16 ECCE Europe) - Karlsruhe, Germany, IEEE, (September 2016)Thermal Study on Leadframe Dimensioning for High Power Dissipation and Low Inductance Commutation Cells, , , , and . PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, page 1-8. (July 2020)Efficiency Requirements for Passively Cooled Converters with Thermal Measurement Based 3D-FEM Simulation, and . in Proc. Conference on Power Electronics and Applications EPE, Lyon, (2020)Thermal Topology Optimization for High Power Density Power Electronic Systems in Passively Cooled Housings, and . in Proc. IEEE Design Methodologies Conference (DMC), Bath, UK, (July 2021)Thermisch und elektrisch optimiertes Leiterplatten-Prepackage für 100V 100A GaN Leistungshalbleiter, , , , and . in Proc. MikroSystemTechnik Kongress, Ludwigsburg, (November 2021)