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Energy and Latency Optimization in NEM Relay-Based Digital Circuits.

, , , , , , , , , and . IEEE Trans. on Circuits and Systems, 61-I (8): 2348-2359 (2014)

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Characterization of chip-to-chip wireless interconnections based on capacitive coupling., , , , , , , and . VLSI-SoC, page 375-380. IEEE, (2010)Soft-core eFPGA for Smart Power applications., , , and . ISSoC, page 1-4. IEEE, (2014)A Long-Distance RF-Powered Sensor Node with Adaptive Power Management for IoT Applications., , , , , , , , , and . Sensors, 17 (8): 1732 (2017)A self-powered WSAN for energy efficient heat distribution., , , , , , and . SAS, page 1-6. IEEE, (2016)Chip-to-chip communication based on capacitive coupling., , , , , , and . 3DIC, page 1-6. IEEE, (2009)3D system on chip memory interface based on modeled capacitive coupling interconnections., , , , , , , and . 3DIC, page 1-4. IEEE, (2010)Input/Output Pad for Direct Contact and Contactless Testing., , , , , , , , , and . European Test Symposium, page 135-140. IEEE Computer Society, (2011)Low power techniques for flash memories., , and . ISCAS (4), page 494-497. IEEE, (2001)From Heterogeneous Sensor Networks to Integrated Software Services: Design and Implementation of a Semantic Architecture for the Internet of Things at ARCES@UNIBO., , , , , , , , , and 6 other author(s). FRUCT, page 10-18. IEEE, (2018)Wake-Up Radio Impact in Self-Sustainability of Sensor and Actuator Wireless Nodes in Smart Home Applications., , , and . IGSC, page 1-7. IEEE, (2018)