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System on chip with 1.12mW-32Gb/s AC-coupled 3D memory interface., , , , , , and . CICC, page 463-466. IEEE, (2009)Automatic Compensation of the Voltage Attenuation in 3-D Interconnection Based on Capacitive Coupling., , , , , and . J. Solid-State Circuits, 46 (2): 498-506 (2011)Characterization of chip-to-chip wireless interconnections based on capacitive coupling., , , , , , , and . VLSI-SoC, page 375-380. IEEE, (2010)A CMOS 3-D Imager Based on Single Photon Avalanche Diode., , , , , and . IEEE Trans. on Circuits and Systems, 54-I (1): 4-12 (2007)Chip-to-chip communication based on capacitive coupling., , , , , , and . 3DIC, page 1-6. IEEE, (2009)3D system on chip memory interface based on modeled capacitive coupling interconnections., , , , , , , and . 3DIC, page 1-4. IEEE, (2010)Input/Output Pad for Direct Contact and Contactless Testing., , , , , , , , , and . European Test Symposium, page 135-140. IEEE Computer Society, (2011)Design of electro-optical demodulating pixel in CMOS technology., , , , , and . ISCAS (1), page 572-575. IEEE, (2005)