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Multicore Signal Processing Platform With Heterogeneous Configurable Hardware Accelerators., , , , , and . IEEE Trans. VLSI Syst., 22 (9): 1990-2003 (2014)Measuring Skin Topographic Structures through Capacitance Image Analysis., , and . AVSS, page 53. IEEE Computer Society, (2006)A massively parallel algorithm for three-dimensional device simulation., , , , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 10 (9): 1201-1209 (1991)Lab on a Chip for Live-Cell Manipulation., , , , and . IEEE Design & Test of Computers, 24 (1): 26-36 (2007)Automatic Compensation of the Voltage Attenuation in 3-D Interconnection Based on Capacitive Coupling., , , , , and . J. Solid-State Circuits, 46 (2): 498-506 (2011)A low-power VLSI feature extractor for speech recognition., , , and . ICASSP, page 3061-3064. IEEE, (1998)Fuzzy-controlled perceptual coding of videophone sequences., , and . IEEE Trans. Fuzzy Systems, 5 (2): 294-303 (1997)Beyond the microscope: embedded detectors for cell biology applications., , , , and . ISCAS (3), page 2911-2914. IEEE, (2005)Fast board-level prototyping of a speech recognition system using virtual emulation., , , , , and . IEEE International Workshop on Rapid System Prototyping, page 20-25. IEEE Computer Society, (1997)3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly., , , , , , , and . J. Solid-State Circuits, 42 (10): 2270-2282 (2007)