Author of the publication

Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs.

, , , , , , and . Microelectronics Reliability, 49 (8): 892-896 (2009)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

An Enhanced HMM-Based for Fuzzy Time Series Forecasting Model., , , , and . IFSA-EUSFLAT, Atlantis Press, (2015)How Customer Participation can Drive Repurchase Intent., , and . PACIS, page 207. (2014)Determining manufacturing parameters to suppress system variance using linear and non-linear models., , , , and . Expert Syst. Appl., 39 (4): 4020-4025 (2012)Construction of a Real-Time and Secure Mobile Ticket System., , , and . J. Inf. Sci. Eng., 25 (3): 807-825 (2009)Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps., , , , , , , and . Microelectronics Reliability, 53 (1): 41-46 (2013)Growth competition between layer-type and porous-type Cu3Sn in microbumps., , , , , , , , and . Microelectronics Reliability, (2017)Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy., , and . Microelectronics Reliability, 53 (1): 2-6 (2013)Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs., , , , , , and . Microelectronics Reliability, 49 (8): 892-896 (2009)Effect of bump size on current density and temperature distributions in flip-chip solder joints., , and . Microelectronics Reliability, 49 (5): 544-550 (2009)How the Perception of Project Success and Accountability Affect the IS process Document Completeness., , and . AMCIS, page 491. Association for Information Systems, (2006)