%0 Journal Article %1 journals/mr/KuanLC09 %A Kuan, Wei-Chih %A Liang, S. W. %A Chen, Chih %D 2009 %J Microelectronics Reliability %K dblp %N 5 %P 544-550 %T Effect of bump size on current density and temperature distributions in flip-chip solder joints. %U http://dblp.uni-trier.de/db/journals/mr/mr49.html#KuanLC09 %V 49

@article{journals/mr/KuanLC09, added-at = {2010-09-28T00:00:00.000+0200}, author = {Kuan, Wei-Chih and Liang, S. W. and Chen, Chih}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/26fdd2dbdfcce37264691aa508ff6b176/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2009.03.001}, interhash = {646aa98bb1086ac7d8bfda9bcf05ccce}, intrahash = {6fdd2dbdfcce37264691aa508ff6b176}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 5, pages = {544-550}, timestamp = {2016-02-02T02:01:07.000+0100}, title = {Effect of bump size on current density and temperature distributions in flip-chip solder joints.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#KuanLC09}, volume = 49, year = 2009 }